Publication:
Optimizing Drying and Storage for Edible Mushrooms: Study on Gamma Irradiation Levels, Drying Temperatures, and Packaging Materials with SVM-Based Predictions

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Abstract

The control of dried product quality is crucial for preservation and marketability. In this study, the effects of gamma irradiation doses (0, 1.2, 2.4, and 3.6 kGy) and drying temperatures (50, 60, and 70 degrees C) on the drying rate, lightness (L & lowast;), and texture firmness of mushroom slices were evaluated. In addition, dried samples were packaged in three materials: polyethylene, polypropylene, and a silicone nanoemulsion-based nanocomposite. After four months, the effect of packaging on L & lowast; and firmness were assessed. Higher irradiation doses and drying temperatures significantly (P < 0.01) enhanced drying rates, ranging from 0.39 g/g center dot min for control samples at 50 degrees C to 0.95 g/g center dot min for 3.6 kGy and 70 degrees C. Higher irradiation doses and lower temperatures yielded better L & lowast; values (74-78) and texture firmness (41-50 N). Packaging materials and drying conditions significantly affected (P < 0.01) texture firmness, while packaging showed no significant effect (P > 0.01) on L & lowast;. The Support Vector Machine (SVM) algorithm accurately predicted change in L & lowast; and texture firmness after six months of storage, with the Pearson universal kernel producing the highest correlation coefficients (0.996, 1.000, and 1.000). This kernel outperformed the others in estimating parameter changes within the integrated SVM-based modeling framework. Overall, gamma irradiation effectively reduced drying time while maintaining product quality, presenting a viable alternative to expensive industrial drying. Nanocomposite packaging preserved the appearance characteristics of the dried mushrooms, and the SVM algorithm demonstrated strong potential for predicting quality changes prior to processing.

Description

Abbasi, Soleiman/0000-0003-1503-2227; Ionescu, Mariana/0000-0002-0346-6186;

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Case Studies in Thermal Engineering

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72

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